252P Series
Compact and Versatile SLS Platform
Farsoon 252P Series combines a 250 × 250 × 320 mm build volume with open parameters, making it ideal for material development and small batch production.
Browse Farsoon 3D printers.
The products below are optional but included in the quote for successful operation.
Equipment: MCWI-15C Chiller, FS-M-50 Powder Mixer, FS04-PPS Powder Cleaning Station, ATTIX 961-01 Industrial Vacuum Cleaner, BT-9060A Sandblasting Machine, HSFD39-5 Nitrogen Generator, DHG-9123AS Powder Drying Oven
Technical Specifications
Download DatasheetSLS (Selective Laser Sintering)
250 × 250 × 320 mm
HT252P: 1 × 55 W CO₂ Laser
ST252P: 1 × 100 W CO₂ Laser
UT252P: 1 × 100 W CO₂ Laser
High-Precision Galvanometer System
≤ 10 m/s
HT252P: 220 °C
ST252P: 280 °C
UT252P: 340 °C
0.06–0.30 mm
Nitrogen
Eight-Zone Heater and Intelligent Temperature Control Systems
Real-Time, Continuous Monitoring and Optimization of the Build Surface Temperature
Windows 11 (64-Bit)
BuildStar, MakeStar®: Open Access to Core Machine Parameters, Real-Time Changes to Build Parameters, 3D Visualization and Fault Diagnostics
STL
HT252P: 1,735 × 1,205 × 1,975 mm
ST252P: 1,735 × 1,225 × 1,975 mm
UT252P: 1,940 × 1,505 × 2,000 mm
HT252P: ~ 1,800 kg
ST252P: ~ 1,800 kg
UT252P: ~ 2,200 kg
400 V ±10%, 3~/N/PE, 50/60 Hz, 40 A
22–28 °C
CE
HT252P: FS1088A-TPU (TPU), FS1092A-TPU (TPU), FS3150CF (PA12-CF), FS3250MF (PA12-MF), FS3300PA (PA12), FS3401GB (PA12-GB), FS4100PA (PA11), FS6140GF (PA6-GF), FS3201PA-F (PA12), FS3300PA-F (PA12), FS3401GB-F (PA12-GB), FS6130CF-F (PA6-CF)
ST252P: FS1088A-TPU (TPU), FS1092A-TPU (TPU), FS3150CF (PA12-CF), FS3250MF (PA12-MF), FS3300PA (PA12), FS3401GB (PA12-GB), FS4100PA (PA11), FS6140GF (PA6-GF), FS8100PPS-GF (PPS-GF), FS3201PA-F (PA12), FS3300PA-F (PA12), FS3401GB-F (PA12-GB), FS6130CF-F (PA6-CF)
UT252P: FS1088A-TPU (TPU), FS1092A-TPU (TPU), FS3150CF (PA12-CF), FS3250MF (PA12-MF), FS3300PA (PA12), FS3401GB (PA12-GB), FS4100PA (PA11), FS6140GF (PA6-GF), FS8100PPS-GF (PPS-GF), FS3201PA-F (PA12), FS3300PA-F (PA12), FS3401GB-F (PA12-GB), FS6130CF-F (PA6-CF), FS-PAEK (PAEK), FS-PEEK (PEEK)
The system is an open platform; besides the listed materials, it is also compatible with third-party materials that the machine specifications support. Parameters must be developed separately.
Three Chamber Tiers for Material Development
Three chamber tiers, from PA12 to PEEK, and a fully open parameter structure: designed for research and development and for material development.
High-Temperature Chamber
220, 280 and 340 °C options; the UT252P can process high-performance polymers such as PAEK and PEEK.
Open Material Platform
Parameters for PA6, PA11, PA12, TPU, filled powders and third-party materials are open to the user.
BuildStar and MakeStar®
Real-time switching between production and expert modes, with 3D visualization and fault diagnostics.
HPD Package Module Cover
The HPD module controls speed and torque. The 3D-printed PAEK cover plate performs stably in high-temperature, high-frequency tests and withstands up to 175 °C.
- Material
- PAEK Family
- System
- UT252P
System Workflow
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Data Preparation
The build is laid out in BuildStar.
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Powder Preparation
Powder is mixed and loaded.
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3D Printing
Parts are built layer by layer with the laser.
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Cooling
The chamber cools in a controlled way.
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Depowdering
Parts are separated from the powder.
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Post-Processing
Sandblasting and surface finishing are applied.
