HONOR's the Magic V2 foldable smartphone was unveiled on July 12th, 2023, by CEO Zhao Ming. This device sets a new standard for foldable smartphones with its ultra-thin profile of just 9.90 mm when closed. This milestone is achieved through the use of metal 3D printing for its critical components.
Overview
Challenge: Reducing the thickness and enhancing the durability of foldable smartphones.
Solution: Adoption of metal 3D printing technology to produce high-precision, aerospace-grade titanium components, ensuring a balance between slimness and strength.
Results: The end product is a foldable smartphone with an impressively slim 9.90 mm profile that successfully withstands over 200,000 folds with only minimal alterations to the screen crease, demonstrating exceptional durability.
HBD is a global LPBF (Laser Powder Bed Fusion) system manufacturer.Partner Customer Stories
Publisher
HBD
Industry
Consumer Products
Application
End-Use Parts
3D Printing Technology
LPBF (Laser Powder Bed Fusion)
3D Printer Used
HBD 200, HBD 350
Material Used
Titanium-Based Alloy
HBD is a global LPBF (Laser Powder Bed Fusion) system manufacturer.Partner Customer Stories
Titanium-Based Alloys for Increased Functionality
Achieved through the advanced metal LPBF (Laser Powder Bed Fusion) systems by HBD to craft the high-precision Luban titanium hinges, Magic V2 redefines the standards for foldable smartphones.
Video courtesy of HONOR.
Use of Metal Additive Manufacturing
HONOR Magic V2 is not just about its slim profile; it brings several firsts to the foldable smartphone market. It is the first to offer zero-risk dimming and comprehensive eye protection on both its internal and external screens. The device is powered by the advanced second-generation Snapdragon 8 processor, includes a proprietary radio frequency enhancement chip, and boasts the new Honor Qinghai Lake dual batteries for extended life.
The key to the Magic V2's slender form factor is the innovative use of metal Laser Powder Bed Fusion (LPBF) by HBD to create the Luban titanium hinges. These hinges not only allow for the phone's thin profile but also enhance its durability. HONOR Magic V2 is the first mobile phone to receive the Swiss SGS high-reliability folding quality gold standard certification. The hinges withstand 400,000 folding tests, with only a minimal 36 μm change in the screen crease after 200,000 foldings.
HONOR Magic V2
Foldable Smartphone Design
Even following 200,000 folds, the screen crease changes minimally, just by 36 μm—roughly the thickness of a human hair.
Video Courtesy of HONOR.
Durable Design and Streamlined Internal Components
Despite its thinness, the Magic V2 does not compromise on durability. The Luban titanium hinges, made through metal PBF, can endure substantial stress, with a strength that withstands up to 1800 MPa and a hardness of 550 HV. HONOR Magic V2’s external screen features second-generation nano-ceramic glass, improving drop resistance by 30% over previous models.
HONORs approach to reducing the phone's thickness involved a reevaluation of every internal component. The titanium alloy 3D printing process used for the hinge is a first, reducing width by 27% while increasing strength by 150%. This balance of lightness and reliability is further supported by customized components like the ultra-thin 0.22 mm heat dissipation VC, the Type-C interface module, and the fingerprint recognition module, all of which contribute to a more compact internal structure.
Capabilities of HBD Systems
The integration of equipment, materials, and technology is a significant challenge in 3D printing metal parts for consumer electronics. HBD's development of a special ultra-fine printing machine and process addresses these challenges. This technology achieves a minimum part forming accuracy of ±0.025 mm and a wall thickness of just 0.20 mm, meeting the demands for lightweight, integrated, and finely structured metal components.
HBD 3D Printers
HBD's metal additive manufacturing solutions enable manufacturers worldwide to accelerate the rate of innovation, unlocking the door to novel applications. Want to learn more? Contact us.
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